Journal

Journal of The Japan Institute of Electronics Packaging

Japan Institute of Electronics Packaging. 3D IC and TSV technologies. 3,955 works and 2,882 citations indexed by CitedEvidence.

Works
3,955
Citations
2,882
H-index
15
ISSN
1343-9677
Open access
No
Impact
0.04

Research Topics

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesDiverse Scientific and Economic StudiesHuman auditory perception and evaluationEducational Robotics and EngineeringCounseling, Therapy, and Family DynamicsSemiconductor Lasers and Optical DevicesLegal case studies and regulationsManufacturing Process and OptimizationElectromagnetic Compatibility and Noise Suppression

Papers in this journal

works

Journal topics

topics