Mechanical Reliability Analysis and Optimization for 3D ICs

doi:https://doi.org/10.1007/978-1-4419-9542-1_13

Book Chapter10.1007/978-1-4419-9542-1_13

Mechanical Reliability Analysis and Optimization for 3D ICs

Sung Kyu Lim-2012-09-24

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Keywords

von Mises yield criterionReliability (semiconductor)Finite element methodStress (linguistics)Reliability engineeringMetric (unit)Superposition principleEngineering

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