Micro-Interconnection Technology. Fluxless Flip Chip Solder Joining for High Density Interconnect.
G.J. Dishon,Stephen M. Bobbio,M.A. PENNINGTON,Robert F. Lipscomb,N. Koopman,S. Nangalia-1995-01-01-The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
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Keywords
Flip chipInterconnectionMaterials scienceSolderingChipThermal copper pillar bumpOptoelectronicsElectronic engineering
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