Book Chapter10.1007/0-306-47000-4_73

A Study on the Surface Integrity of Single Crystal Silicon Ground by CIFB-diamond Wheels(ELID) and Resin-bonded Diamond Wheels

Choung Lii Chao,Kiseri Kubati J,D. S. Liu,S. C. Sheu,Yongliang Lin,H. Y. Lin-2002-01-01

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Keywords

GrindGrindingDiamondDiamond grindingMaterials scienceGrinding wheelMachiningWafer

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