Thermal and mechanical optimisation of diode laser bar packaging

TL;DRAbstract

Increasing the reliability of high power diode laser bars as a viable photon source in pumping and direct applications is necessary as increased reliability reduces costs and makes diode lasers more attractive for use. High stress levels and high thermal loads are the limiting factors for the lifetime of diode lasers. Large amounts of stress can be caused by the packaging process due to the expansion mismatch of the semiconductor and heat sink materials. Ductile solder is used to compensate for the mismatch. By using an expansion matched submount, a brittle solder such as gold-tin can be used. At the same time, due to the lower thermal conductivity of this expansion matched material, the thermal load increases. Here, the effects of expansion matching work against the reduction of the thermal load. For higher reliability of diode lasers, the packaging induced stress and thermal load need to be reduced.The thermal and mechanical influence of the packaging process on diode laser bars is d

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