Article10.1109/issm.2003.1243266

A highly reliable aluminum interconnect etching process control for 0.13 μm flash technology

J. Yamamoto,Tien-Chin Hsieh,Takuya Kondoh,Theodore R. Maki,T. Tanimoto,J. Ogura+2 more-2004-05-13

2

Chat with Paper

AI Agents for this Paper

No abstract available for this paper.

Keywords

Etching (microfabrication)InterconnectionFlash (photography)Process controlProcess (computing)AluminiumMaterials scienceComputer science

Chat

Click to start Chat