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Open AccessReport10.2172/764381

Creep of SiC Hot-Pressed with Al, B, and C

Mark E. Sixta-2000-03-31
3

TL;DRAbstract

The creep of a high strength, high toughness SiC, sintered with Al, B, and C was investigated. For elevated temperature applications, the time-dependent deformation, creep response, must be fully characterized for candidate materials. The mechanisms responsible for high temperature deformation in ABC-SiC were evaluated. The creep response was compared to materials that have glassy grain boundary phases but do not have interlocked grains. The creep mechanisms were assessed.

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The creep of a high strength, high toughness SiC, sintered with Al, B, and C was investigated. For elevated temperature applications, the time-dependent deformation, creep response, must be fully characterized for candidate materials. The mechanisms responsible for high temperature deformation in ABC-SiC were evaluated. The creep response was compared to materials that have glassy grain boundary phases but do not have interlocked grains. The creep mechanisms were assessed.

Keywords

CreepMaterials scienceGrain boundaryComposite materialDeformation (meteorology)ToughnessDiffusion creepGrain Boundary Sliding

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