Book Chapter10.1007/978-1-4614-9176-7_5

Frontiers of Cu Electrodeposition and Electroless Plating for On-chip Interconnects

James F. Rohan,Damien Thompson-2013-11-20-Nanostructure science and technology

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Keywords

InterconnectionMaterials scienceResistorTransistorOptoelectronicsPrinted circuit boardElectrical conductorElectrical engineering

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