Microstructure Control of Sn-Cu-Ni Alloys for Pb-free Solder Applications

TL;DRAbstract

The rapid increase of electronic equipment and scrapped electrical products that accompany with high technology nowadays is significantly influencing the environment. As the products are disposed into landfill sites, a concern has arisen that there is a possible increase of lead in the solders leaching into the groundwater. These contaminants have been the stimulus for the international community to issue a directive to prohibiting the use of lead-containing solders in electronic devices and effectively banning such products on the market.The present work corresponds to part of a wider program that will couple existing tools for thermodynamic and kinetic alloy modelling; and tailor them to allow for the development of reliable modelling of lead-free solder alloys. With respect to the available research, the biggest barriers to predicting/controlling microstructure and developing the next-generation of solder alloys is the lack of reliable thermodynamic and kinetic data which is require

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