Journal
IEEE Transactions on Components Packaging and Manufacturing Technology
Institute of Electrical and Electronics Engineers. Electronic Packaging and Soldering Technologies. 5,057 works and 58,885 citations indexed by CitedEvidence.
Works
5,057
Citations
58,885
H-index
77
ISSN
2156-3950
Open access
No
Impact
2.07
Research Topics
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise SuppressionMicrowave Engineering and WaveguidesAdvanced Antenna and Metasurface TechnologiesHeat Transfer and OptimizationSilicon Carbide Semiconductor TechnologiesRadio Frequency Integrated Circuit DesignAntenna Design and AnalysisFerroelectric and Negative Capacitance Devices