Journal
Journal of Electronic Materials
Springer Science+Business Media. Electronic Packaging and Soldering Technologies. 18,614 works and 282,622 citations indexed by CitedEvidence.
Works
18,614
Citations
282,622
H-index
133
ISSN
0361-5235
Open access
No
Impact
2.48
Research Topics
Electronic Packaging and Soldering TechnologiesSemiconductor materials and devicesChalcogenide Semiconductor Thin FilmsSemiconductor Quantum Structures and DevicesAdvanced Thermoelectric Materials and DevicesAdvanced Semiconductor Detectors and MaterialsSemiconductor materials and interfacesZnO doping and properties3D IC and TSV technologiesGaN-based semiconductor devices and materials