Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section

doi:https://doi.org/10.1007/1-84628-235-7_39

Book Chapter10.1007/1-84628-235-7_39

Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section

Michael Meyer,I. Zienert,Ehrenfried Zschech-2006-07-01-Engineering materials and processes

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Keywords

Electron backscatter diffractionCross section (physics)Backscatter (email)DiffractionSection (typography)Materials scienceElectron diffractionElectron

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