Lamination model

TL;DRAbstract

Laminated composites have been used extensively as printed circuit board (PCB) material in electronic packaging. Determination of the macroscopic properties of a PCB made of a laminated composite is a key step in designing a new PCB or selecting a PCB tailored for a specific packaging application. A laminated composite PCB consists of a number of laminae where each lamina itself is a composite made of discontinuous filler or continuous filler (straight fibers or woven fabrics). A lamination model is used to predict the overall properties of a laminated composite for a given set of properties of the laminae. It is assumed that the properties of each lamina are already obtained by experiment or predicted by a composite model such as the Eshelby model. Here, we apply the classical lamination theory only when a thin plate composed of laminae is subjected to thermomechanical loading and/or an electric field with the aim of finding the deflection of the plate and stress field within the lami

Chat with Paper

AI Agents for this Paper