Journal

Journal of The Japan Institute of Electronics Packaging

Japan Institute of Electronics Packaging. 3D IC and TSV technologies. 3,955 works and 2,882 citations indexed by CitedEvidence.

Works

3,955

Citations

2,882

H-index

ISSN

1343-9677

Open access

Impact

0.04

Research Topics

3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesDiverse Scientific and Economic StudiesHuman auditory perception and evaluationEducational Robotics and EngineeringCounseling, Therapy, and Family DynamicsSemiconductor Lasers and Optical DevicesLegal case studies and regulationsManufacturing Process and OptimizationElectromagnetic Compatibility and Noise Suppression