Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications
2015 · ACS Applied Materials & Interfaces · 351 citations
https://doi.org/10.1021/acsami.5b02134
G
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
209
Papers
6.7K
Citations
44
h-index
144
i10-index
Guisheng Zou is an academic researcher from Aerospace Research Institute of Materials and Processing Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Nanomaterials and Printing Technologies. The author has an h-index of 44, co-authored 178 publications.
ORCID: 0009-0003-8501-0370Papers by this author
worksArtificial Intelligence Meets Flexible Sensors: Emerging Smart Flexible Sensing Systems Driven by Machine Learning and Artificial Synapses
2023 · Nano-Micro Letters · 274 citations
https://doi.org/10.1007/s40820-023-01235-x
Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
2012 · Scripta Materialia · 208 citations
https://doi.org/10.1016/j.scriptamat.2012.01.007
A wireless, implantable optoelectrochemical probe for optogenetic stimulation and dopamine detection
2020 · Microsystems & Nanoengineering · 104 citations
https://doi.org/10.1038/s41378-020-0176-9
Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications
2018 · Journal of Alloys and Compounds · 102 citations
https://doi.org/10.1016/j.jallcom.2018.10.067
High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
2020 · Acta Metallurgica Sinica (English Letters) · 59 citations
https://doi.org/10.1007/s40195-020-01083-3
Research topics
topicsChat about Author
Papers
Chat
Click to start Chat