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Hailin Bai

Tsinghua University(CN)

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36

Papers

951

Citations

16

h-index

20

i10-index

Hailin Bai is an academic researcher from Tsinghua University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Nanomaterials and Printing Technologies & Physics of Superconductivity and Magnetism. The author has an h-index of 16, co-authored 31 publications.

Research Topics

Electronic Packaging and Soldering Technologies Nanomaterials and Printing Technologies Physics of Superconductivity and Magnetism Aluminum Alloys Composites Properties Superconducting Materials and Applications

Papers by this author

works

Microstructural and mechanical evolution of silver sintering die attach for SiC power devices during high temperature applications

2018 · Journal of Alloys and Compounds · 102 citations

https://doi.org/10.1016/j.jallcom.2018.10.067

Hongqiang Zhang Wengan Wang Hailin Bai Guisheng Zou

High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications

2020 · Acta Metallurgica Sinica (English Letters) · 59 citations

https://doi.org/10.1007/s40195-020-01083-3

Hongqiang Zhang Hailin Bai Qiang Jia Wei Guo

Research topics

topics

Electronic Packaging and Soldering Technologies

Nanomaterials and Printing Technologies

Physics of Superconductivity and Magnetism

Aluminum Alloys Composites Properties

Superconducting Materials and Applications

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