High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
2020 · Acta Metallurgica Sinica (English Letters) · 59 citations
https://doi.org/10.1007/s40195-020-01083-3
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Qiang Jia
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Qiang Jia is an academic researcher from Beijing University of Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Aluminum Alloys Composites Properties. The author has an h-index of 30, co-authored 121 publications.
ORCID: 0000-0001-8572-980XPapers by this author
worksImproved corrosion resistance of Ni-base Alloy 600 welded joint by laser shock peening
2022 · Journal of Manufacturing Processes · 44 citations
https://doi.org/10.1016/j.jmapro.2022.05.061
Solar Evaporators for Saline Water: Sustainable Clean Water Harvesting and Critical Mineral Resources Extraction
2025 · ACS Nano · 44 citations
https://doi.org/10.1021/acsnano.5c00564
Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging
2024 · Journal of Electronic Materials · 29 citations
https://doi.org/10.1007/s11664-024-10970-9
Additive manufacturing of a new non-equiatomic high-entropy alloy with exceptional strength-ductility synergy via in-situ alloying
2024 · Materials & Design · 25 citations
https://doi.org/10.1016/j.matdes.2024.112676
The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis
2023 · IEEE Transactions on Components Packaging and Manufacturing Technology · 22 citations
https://doi.org/10.1109/tcpmt.2023.3290303
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