Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging
2012 · Scripta Materialia · 208 citations
https://doi.org/10.1016/j.scriptamat.2012.01.007
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Jianfeng Yan
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Jianfeng Yan is an academic researcher from Worcester Polytechnic Institute. The author has contributed to research in topics: Laser-Ablation Synthesis of Nanoparticles & Electronic Packaging and Soldering Technologies & Nanomaterials and Printing Technologies. The author has an h-index of 31, co-authored 146 publications.
ORCID: 0000-0001-8356-2444Papers by this author
worksDense Hybrid Recurrent Multi-view Stereo Net with Dynamic Consistency Checking
2020 · Lecture notes in computer science · 177 citations
https://doi.org/10.1007/978-3-030-58548-8_39
A Review of Sintering-Bonding Technology Using Ag Nanoparticles for Electronic Packaging
2021 · Nanomaterials · 85 citations
https://doi.org/10.3390/nano11040927
Nanoscale multi-beam lithography of photonic crystals with ultrafast laser
2023 · Light Science & Applications · 69 citations
https://doi.org/10.1038/s41377-023-01178-3
Atomic‐Level Insight into the Formation of Subsurface Dislocation Layer and Its Effect on Mechanical Properties During Ultrafast Laser Micro/Nano Fabrication
2021 · Advanced Functional Materials · 44 citations
https://doi.org/10.1002/adfm.202108802
Experimental and numerical studies of fatigue behavior of Ti6Al4V alloy treated by laser shock peening
2022 · Surface and Coatings Technology · 35 citations
https://doi.org/10.1016/j.surfcoat.2022.128524
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