Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
2009 · 30 citations
https://doi.org/10.1109/ectc.2009.5074036
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12
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158
Citations
6
h-index
5
i10-index
Ahmad Khairyanto is an academic researcher from Nanyang Technological University. The author has contributed to research in topics: Optical Coherence Tomography Applications & Advanced Surface Polishing Techniques & 3D IC and TSV technologies. The author has an h-index of 6, co-authored 11 publications.
https://doi.org/10.1109/ectc.2009.5074036
https://doi.org/10.1109/ectc.2008.4549988
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