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J

John H. Lau

Micron Corporation (United States)(US)

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577

Papers

13.6K

Citations

54

h-index

269

i10-index

John H. Lau is an academic researcher from Micron Corporation (United States). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Additive Manufacturing and 3D Printing Technologies. The author has an h-index of 54, co-authored 491 publications.

ORCID: 0000-0003-1284-8829

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Additive Manufacturing and 3D Printing Technologies Electromagnetic Compatibility and Noise Suppression Nanofabrication and Lithography Techniques

Papers by this author

works

Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking

2009 · 30 citations

https://doi.org/10.1109/ectc.2009.5074036

Won Kyoung Choi C.S. Premachandran Ong Siong Chiew Ling Xie

A novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications

2008 · 22 citations

https://doi.org/10.1109/ectc.2008.4549988

C.S. Premachandran John H. Lau Ling Xie Ahmad Khairyanto

The Amazon Nova Family of Models: Technical Report and Model Card

2025 · ArXiv.org · 1 citations

https://doi.org/10.48550/arxiv.2506.12103

Amazon AGI A. Langford Aayush Shah Arnab Gupta

Research topics

topics

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies

Additive Manufacturing and 3D Printing Technologies

Electromagnetic Compatibility and Noise Suppression

Nanofabrication and Lithography Techniques

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