Development of novel intermetallic joints using thin film indium based solder by low temperature bonding technology for 3D IC stacking
2009 · 30 citations
https://doi.org/10.1109/ectc.2009.5074036
L
Ling Xie
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67
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431
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12
h-index
14
i10-index
Ling Xie is an academic researcher from Agency for Science, Technology and Research. The author has contributed to research in topics: 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies & Additive Manufacturing and 3D Printing Technologies. The author has an h-index of 12, co-authored 57 publications.
Papers by this author
worksA novel, wafer-level stacking method for low-chip yield and non-uniform, chip-size wafers for MEMS and 3D SIP applications
2008 · 22 citations
https://doi.org/10.1109/ectc.2008.4549988
Hofmeister anion-guided engineering of water’s hydrogen bond network for dendrite-suppressed zinc metal anodes
2025 · Chemical Engineering Journal · 0 citations
https://doi.org/10.1016/j.cej.2025.167901
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