To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
2023 · Journal of Materials Research and Technology · 14 citations
https://doi.org/10.1016/j.jmrt.2023.05.084
D
Dinh-Phuc Tran
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Dinh-Phuc Tran is an academic researcher from National Yang Ming Chiao Tung University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Antenna Design and Analysis & 3D IC and TSV technologies. The author has an h-index of 19, co-authored 94 publications.
ORCID: 0000-0003-2893-2291Papers by this author
worksElectroless-deposition of epitaxial (111)-oriented silver on nanotwinned copper microbumps for metal direct bonding
2023 · Journal of Materials Research and Technology · 12 citations
https://doi.org/10.1016/j.jmrt.2023.11.241
Enhancement of fatigue resistance by recrystallization and grain growth to eliminate bonding interfaces in Cu–Cu joints
2022 · Scientific Reports · 11 citations
https://doi.org/10.1038/s41598-022-16957-y
Enhanced cross-interfacial growth by thickening transition layers and tailoring grain size of columnar nanotwinned Cu films
2024 · Journal of Materials Research and Technology · 4 citations
https://doi.org/10.1016/j.jmrt.2024.09.239
Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size
2025 · Journal of Advanced Joining Processes · 3 citations
https://doi.org/10.1016/j.jajp.2025.100320
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