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Mai-Phuong La

National Yang Ming Chiao Tung University(TW)

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13

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26

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3

h-index

1

i10-index

Mai-Phuong La is an academic researcher from National Yang Ming Chiao Tung University. The author has contributed to research in topics: Copper Interconnects and Reliability & Electrodeposition and Electroless Coatings & Aluminum Alloys Composites Properties. The author has an h-index of 3, co-authored 12 publications.

Research Topics

Copper Interconnects and Reliability Electrodeposition and Electroless Coatings Aluminum Alloys Composites Properties 3D IC and TSV technologies Microstructure and mechanical properties

Papers by this author

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Regulating intermetallic compound growth and bridging in SnAg solder under electromigration stress through Ni addition and sn crystallographic orientation-grain size

2025 · Journal of Advanced Joining Processes · 3 citations

https://doi.org/10.1016/j.jajp.2025.100320

Dinh-Phuc Tran Ya-Ting Xiao Mai-Phuong La Shuguang Yang

Effect of SiCN passivation on electromigration reliability of nanotwinned Cu redistribution lines

2025 · Journal of Materials Research and Technology · 2 citations

https://doi.org/10.1016/j.jmrt.2025.04.139

Yu‐Wen Hung Mai-Phuong La Yi-Quan Lin K. N. Tu

Research topics

topics

Copper Interconnects and Reliability

Electrodeposition and Electroless Coatings

Aluminum Alloys Composites Properties

3D IC and TSV technologies

Microstructure and mechanical properties

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