Efficiency boost of bifacial Cu(In,Ga)Se2 thin-film solar cells for flexible and tandem applications with silver-assisted low-temperature process
2022 · Nature Energy · 111 citations
https://doi.org/10.1038/s41560-022-01157-9
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Shih‐Chi Yang
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Shih‐Chi Yang is an academic researcher from National Yang Ming Chiao Tung University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Copper Interconnects and Reliability & Quantum Dots Synthesis And Properties. The author has an h-index of 16, co-authored 41 publications.
ORCID: 0000-0002-0312-4194Papers by this author
worksDegradation and self-repairing in perovskite light-emitting diodes
2021 · Matter · 87 citations
https://doi.org/10.1016/j.matt.2021.09.007
To suppress thermomigration of Cu–Sn intermetallic compounds in flip-chip solder joints
2023 · Journal of Materials Research and Technology · 14 citations
https://doi.org/10.1016/j.jmrt.2023.05.084
Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect
2024 · Journal of Materials Research and Technology · 10 citations
https://doi.org/10.1016/j.jmrt.2024.10.133
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