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M

M.S. Chang

Northwestern Polytechnical University(CN)

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14

Papers

184

Citations

8

h-index

5

i10-index

M.S. Chang is an academic researcher from Northwestern Polytechnical University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & High Temperature Alloys and Creep & Fatigue and fracture mechanics. The author has an h-index of 8, co-authored 12 publications.

Research Topics

Electronic Packaging and Soldering Technologies High Temperature Alloys and Creep Fatigue and fracture mechanics 3D IC and TSV technologies Nuclear Materials and Properties

Papers by this author

works

Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows

2023 · Journal of Materials Research and Technology · 8 citations

https://doi.org/10.1016/j.jmrt.2023.09.139

M.S. Chang Mohd Arif Anuar Mohd Salleh Dewi Suriyani Che Halin Flora Somidin

Research topics

topics

Electronic Packaging and Soldering Technologies

High Temperature Alloys and Creep

Fatigue and fracture mechanics

3D IC and TSV technologies

Nuclear Materials and Properties

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