Contribution of Ni microalloying to Cu dissolution in In–35Sn/Cu solder joints after multiple reflows
2023 · Journal of Materials Research and Technology · 8 citations
https://doi.org/10.1016/j.jmrt.2023.09.139
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54
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432
Citations
11
h-index
13
i10-index
Flora Somidin is an academic researcher from University of Queensland. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Advanced Welding Techniques Analysis. The author has an h-index of 11, co-authored 46 publications.
ORCID: 0000-0002-1418-458XClick to start Chat