An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers
2024 · Microsystems & Nanoengineering · 15 citations
https://doi.org/10.1038/s41378-024-00713-5
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Ziyue Zhang
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11
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15
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Ziyue Zhang is an academic researcher from Beijing Institute of Technology. The author has contributed to research in topics: 3D IC and TSV technologies & Advanced Fiber Laser Technologies & Electronic Packaging and Soldering Technologies. The author has an h-index of 11, co-authored 63 publications.
ORCID: 0000-0002-9218-7233Papers by this author
worksA microgripper based on electrothermal Al–SiO2 bimorphs
2024 · Microsystems & Nanoengineering · 8 citations
https://doi.org/10.1038/s41378-024-00821-2
Toxicological effects, absorption and biodegradation of bisphenols with different functional groups in Chromochloris zofingiensis
2024 · Journal of Hazardous Materials · 5 citations
https://doi.org/10.1016/j.jhazmat.2024.135728
Nitrogen-doped carbon quantum dots from pumpkin for the sensing of nifuratel and temperature
2025 · Spectrochimica Acta Part A Molecular and Biomolecular Spectroscopy · 5 citations
https://doi.org/10.1016/j.saa.2025.125758
A tip-tilt-piston electrothermal micromirror array with integrated position sensors
2025 · Microsystems & Nanoengineering · 1 citations
https://doi.org/10.1038/s41378-024-00835-w
A contamination-free and low-leakage-current Cu-TSV technology enabled by engineered double-sided processing
2025 · Microsystems & Nanoengineering · 1 citations
https://doi.org/10.1038/s41378-025-01018-x
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