Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects
2024 · Journal of Materials Research and Technology · 5 citations
https://doi.org/10.1016/j.jmrt.2024.01.135
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16
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106
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6
h-index
4
i10-index
Seongi Lee is an academic researcher from Kumoh National Institute of Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & High Entropy Alloys Studies & Copper Interconnects and Reliability. The author has an h-index of 6, co-authored 14 publications.
https://doi.org/10.1016/j.jmrt.2024.01.135
https://doi.org/10.2139/ssrn.4654527
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