Effect of Ag agglomeration-driven nanovoids formation on fatigue reliability of Cu–Ag alloy flexible interconnects
2024 · Journal of Materials Research and Technology · 5 citations
https://doi.org/10.1016/j.jmrt.2024.01.135
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Jun Hyeok Hyun is an academic researcher from Kumoh National Institute of Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Welding Techniques and Residual Stresses & Copper Interconnects and Reliability. The author has an h-index of 2, co-authored 7 publications.
https://doi.org/10.1016/j.jmrt.2024.01.135
https://doi.org/10.2139/ssrn.4654527
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