Estimation of warpage and thermal stress of IVHs in flip–chip ball grid arrays package by FEM
2007 · Microelectronics Reliability · 21 citations
https://doi.org/10.1016/j.microrel.2007.06.001
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Seung-Hyun Cho
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124
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968
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18
h-index
26
i10-index
Seung-Hyun Cho is an academic researcher from Korea Advanced Institute of Science and Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Engineering Applied Research. The author has an h-index of 18, co-authored 106 publications.
ORCID: 0000-0003-1856-064XPapers by this author
worksOptimization of culture conditions to generate vascularized multi-lineage liver organoids with structural complexity and functionality
2024 · Biomaterials · 14 citations
https://doi.org/10.1016/j.biomaterials.2024.122898
Hybrid radio-over-fiber transport system to support heterogeneous indoor mobile network environments
2023 · Journal of Optical Communications and Networking · 6 citations
https://doi.org/10.1364/jocn.503220
hESC-derived extracellular vesicles enriched with MFGE-8 and the GSH redox system act as senotherapeutics for neural stem cells in ischemic stroke
2025 · Free Radical Biology and Medicine · 5 citations
https://doi.org/10.1016/j.freeradbiomed.2025.01.050
MFGE‐8, a Corona Protein on Extracellular Vesicles, Mediates Self‐Renewal and Survival of Human Pluripotent Stem Cells
2025 · Journal of Extracellular Vesicles · 5 citations
https://doi.org/10.1002/jev2.70056
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