Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
2019 · Materials & Design · 85 citations
https://doi.org/10.1016/j.matdes.2019.108144
J
Jiahui Li
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Jiahui Li is an academic researcher from China University of Geosciences. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Aluminum Alloys Composites Properties. The author has an h-index of 14, co-authored 26 publications.
ORCID: 0000-0003-4828-9440Papers by this author
worksEffect of FeCoNiCrCu0.5 High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
2019 · Scientific Reports · 13 citations
https://doi.org/10.1038/s41598-019-40268-4
A Cu-Cu Bonding Method Using Preoxidized Cu Microparticles under Formic Acid Atmosphere
2019 · 9 citations
https://doi.org/10.23919/icep.2019.8733490
Effect of copper on interfacial reaction and microstructure of soldering on aluminum substrate
2025 · Journal of Materials Research and Technology · 3 citations
https://doi.org/10.1016/j.jmrt.2025.07.059
Effect of electrodeposition parameters on the morphology and corrosion resistance of a FeCoNiCr medium-entropy alloy coating on a conductive Al alloy surface
2025 · Materials Today Communications · 0 citations
https://doi.org/10.1016/j.mtcomm.2025.114367
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