https://doi.org/10.1002/smtd.202200995
Wenqi Zhang
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284
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h-index
76
i10-index
Wenqi Zhang is an academic researcher from Harbin University of Science and Technology. The author has contributed to research in topics: 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies & Semiconductor materials and devices. The author has an h-index of 27, co-authored 242 publications.
ORCID: 0000-0001-8142-7791Papers by this author
workshttps://doi.org/10.1016/j.jmrt.2023.03.073
https://doi.org/10.1016/j.cej.2022.140907
https://doi.org/10.1002/smtd.202201627
https://doi.org/10.1002/adma.202301439
https://doi.org/10.1002/smll.202505411
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