/
User Settings
A

Claim or correct this author profile

Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.

13

Papers

216

Citations

6

h-index

5

i10-index

Airu Wang is an academic researcher from Nanjing Tech University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Perovskite Materials and Applications. The author has an h-index of 6, co-authored 12 publications.

Research Topics

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesPerovskite Materials and ApplicationsAdvanced Welding Techniques AnalysisAdvanced materials and composites

Papers by this author

works

Research topics

topics

Chat about Author

Papers

Chat

Click to start Chat