/

Workspace

Research & Review

Writing & Publishing

Data & Analysis

Utilities

Account

User Settings

A

Anil Kunwar

Silesian University of Technology(PL)

Claim or correct this author profile

Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.

115

Papers

1.2K

Citations

18

h-index

35

i10-index

Anil Kunwar is an academic researcher from Silesian University of Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Aluminum Alloy Microstructure Properties. The author has an h-index of 18, co-authored 98 publications.

ORCID: 0000-0003-4295-5772

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Aluminum Alloy Microstructure Properties Intermetallics and Advanced Alloy Properties Solidification and crystal growth phenomena

Papers by this author

works

In situ study on the increase of intermetallic compound thickness at anode of molten tin due to electromigration of copper

2015 · Scripta Materialia · 40 citations

https://doi.org/10.1016/j.scriptamat.2015.05.027

Haitao Ma Anil Kunwar Junhao Sun

On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solders under thermal gradient

2016 · Materials Letters · 32 citations

https://doi.org/10.1016/j.matlet.2016.02.075

Anil Kunwar Haoran Ma Haoran Ma Haitao Ma

Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during multiple reflows

2018 · Intermetallics · 28 citations

https://doi.org/10.1016/j.intermet.2018.01.022

Haofang Ma Haofang Ma Anil Kunwar Shengyan Shang

Study of electrochemical migration based transport kinetics of metal ions in Sn-9Zn alloy

2018 · Microelectronics Reliability · 17 citations

https://doi.org/10.1016/j.microrel.2018.02.013

Haoran Ma Haoran Ma Anil Kunwar Jun Chen

Multi-phase field simulation of Al <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" id="d1e1157" altimg="si16.svg"> <mml:msub> <mml:mrow/> <mml:mrow> <mml:mn>3</mml:mn> </mml:mrow> </mml:msub> </mml:math> Ni <mml:math xmlns:mml="http://www.w3.org/1998/Math/MathML" display="inline" id="d1e1165" altimg="si17.svg"> <mml:msub> <mml:mrow/> <mml:mrow> <mml:mn>2</mml:mn> </mml:mrow> </mml:msub> </mml:math> intermetallic growth at liquid Al/solid Ni interface using MD computed interfacial energies

2021 · International Journal of Mechanical Sciences · 17 citations

https://doi.org/10.1016/j.ijmecsci.2021.106930

Anil Kunwar Ensieh Yousefi Xiaojing Zuo Youqing Sun

pyMPEALab Toolkit for Accelerating Phase Design in Multi-principal Element Alloys

2021 · Metals and Materials International · 10 citations

https://doi.org/10.1007/s12540-021-01100-9

Upadesh Subedi Anil Kunwar Yuri Amorim Coutinho Khem Gyanwali

Research topics

topics

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies

Aluminum Alloy Microstructure Properties

Intermetallics and Advanced Alloy Properties

Solidification and crystal growth phenomena

Chat about Author

Papers

Chat

Click to start Chat