High-stability reflective bonding pads for GaN-based flip-chip light-emitting diodes packaged by reflow soldering
2019 · Journal of Physics D Applied Physics · 4 citations
https://doi.org/10.1088/1361-6463/ab1891
R
Renli Liang
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42
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818
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19
h-index
25
i10-index
Renli Liang is an academic researcher from South China University of Technology. The author has contributed to research in topics: GaN-based semiconductor devices and materials & ZnO doping and properties & Ga2O3 and related materials. The author has an h-index of 19, co-authored 36 publications.
ORCID: 0000-0002-2672-909XPapers by this author
worksMicrocup® Electronic Paper by Roll-To-Roll Manufacturing Processes
2003 · ScholarWorks@BGSU (Bowling Green State University) · 3 citations
Enhanced nitrogen and phosphorus removal from actual domestic sewage using a novel ecological AAO process integrated with natural zeolite and vegetation
2025 · Journal of Water Process Engineering · 1 citations
https://doi.org/10.1016/j.jwpe.2025.107825
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