https://doi.org/10.1126/science.1065879
Xiangxu Chen
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
54
Papers
3.0K
Citations
12
h-index
14
i10-index
Xiangxu Chen is an academic researcher from Zhongda Hospital Southeast University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Epoxy Resin Curing Processes & Hip and Femur Fractures. The author has an h-index of 12, co-authored 46 publications.
ORCID: 0000-0002-2132-1781Papers by this author
workshttps://doi.org/10.1186/s13287-025-04252-2
https://doi.org/10.1016/j.jep.2024.118098
https://doi.org/10.1016/j.midw.2022.103394
https://doi.org/10.3390/ma17153682
https://doi.org/10.1016/j.microrel.2024.115514
Research topics
topicsChat about Author
Papers
Chat
Click to start Chat