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Vance Liu

Micron (United States)(US)

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5

Papers

26

Citations

3

h-index

1

i10-index

Vance Liu is an academic researcher from Micron (United States). The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Aluminum Alloys Composites Properties & 3D IC and TSV technologies. The author has an h-index of 3, co-authored 5 publications.

ORCID: 0000-0002-9401-9583

Research Topics

Electronic Packaging and Soldering Technologies Aluminum Alloys Composites Properties 3D IC and TSV technologies Integrated Circuits and Semiconductor Failure Analysis Electromagnetic Compatibility and Noise Suppression

Papers by this author

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Solder joint reliability performance study and shear characterization of low-Ag SAC lead-free solders for handheld application

2024 · Materials Science in Semiconductor Processing · 14 citations

https://doi.org/10.1016/j.mssp.2024.108489

Vance Liu Yung-Sheng Zou Yiyu Chen Wan Ling Chang

Research topics

topics

Electronic Packaging and Soldering Technologies

Aluminum Alloys Composites Properties

3D IC and TSV technologies

Integrated Circuits and Semiconductor Failure Analysis

Electromagnetic Compatibility and Noise Suppression

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