The growth behavior and kinetics of intermetallic compounds in Cu–Al interface at 600°C–800 °C
2024 · Intermetallics · 24 citations
https://doi.org/10.1016/j.intermet.2024.108244
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Weijia Guo
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38
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10
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10
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Weijia Guo is an academic researcher from Beijing Institute of Technology. The author has contributed to research in topics: Advanced Surface Polishing Techniques & Advanced materials and composites & Advanced machining processes and optimization. The author has an h-index of 10, co-authored 33 publications.
ORCID: 0000-0001-8228-3240Papers by this author
worksA novel strategy for activation technique for 6H-SiC substrates in electroless Ni-P plating processes
2024 · Results in Engineering · 22 citations
https://doi.org/10.1016/j.rineng.2024.103126
Exothermic reactivity-driven structural optimization and performance enhancement for Cu-Al-Si porous materials: A comparison of Gas-Atomized and Ball-Milled Al-Si powders
2025 · Journal of Alloys and Compounds · 1 citations
https://doi.org/10.1016/j.jallcom.2025.181831
Atmospheric plasma activation enhanced electroless Ni-P plating on binderless WC
2025 · Results in Engineering · 0 citations
https://doi.org/10.1016/j.rineng.2025.108542
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