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J

Junghwan Bang

Korea Institute of Industrial Technology(KR)

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72

Papers

595

Citations

14

h-index

21

i10-index

Junghwan Bang is an academic researcher from Korea Institute of Industrial Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Advanced Welding Techniques Analysis. The author has an h-index of 14, co-authored 62 publications.

ORCID: 0000-0002-0226-9076

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Advanced Welding Techniques Analysis Aluminum Alloys Composites Properties Intermetallics and Advanced Alloy Properties

Papers by this author

works

Mechanical properties of TiC reinforced MgO–ZrO2 composites via spark plasma sintering

2023 · Ceramics International · 17 citations

https://doi.org/10.1016/j.ceramint.2023.02.091

Junho Lee Kyu-bong Jang Seokhyun Lee Chan Bin Mo

Fast, facile and thermal damage free nanowelding of Ag nanowire for flexible transparent conductive film by pressure-assisted microwave irradiation

2023 · Scientific Reports · 6 citations

https://doi.org/10.1038/s41598-023-41646-9

Jong‐Min Jeong Minjeong Sohn Junghwan Bang Tae‐Ik Lee

Research topics

topics

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies

Advanced Welding Techniques Analysis

Aluminum Alloys Composites Properties

Intermetallics and Advanced Alloy Properties

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