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Lingyao Sun

Beijing Institute of Technology(CN)

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4

Papers

40

Citations

2

h-index

2

i10-index

Lingyao Sun is an academic researcher from Beijing Institute of Technology. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Advanced Welding Techniques Analysis. The author has an h-index of 2, co-authored 4 publications.

ORCID: 0000-0002-9605-5406

Research Topics

Electronic Packaging and Soldering Technologies 3D IC and TSV technologies Advanced Welding Techniques Analysis Additive Manufacturing and 3D Printing Technologies Adhesion, Friction, and Surface Interactions

Papers by this author

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Preparation and performance of Sn-based composite solder joints by solid-liquid low-temperature solder bonding technology

2023 · Journal of Materials Research and Technology · 22 citations

https://doi.org/10.1016/j.jmrt.2023.04.234

Xue-Feng Wu Lingyao Sun Yingxia Liu Ziting Ye

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

2022 · Micromachines · 18 citations

https://doi.org/10.3390/mi13060867

Lingyao Sun Zhenhua Guo Xiuchen Zhao Ying Liu

Research topics

topics

Electronic Packaging and Soldering Technologies

3D IC and TSV technologies

Advanced Welding Techniques Analysis

Additive Manufacturing and 3D Printing Technologies

Adhesion, Friction, and Surface Interactions

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