A High Coupling Coefficient and Symmetric Transformer Based on TSV
2024 · IEEE Transactions on Components Packaging and Manufacturing Technology · 24 citations
https://doi.org/10.1109/tcpmt.2024.3503561
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Xiangkun Yin
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68
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731
Citations
16
h-index
24
i10-index
Xiangkun Yin is an academic researcher from Xidian University. The author has contributed to research in topics: 3D IC and TSV technologies & Microwave Engineering and Waveguides & Radio Frequency Integrated Circuit Design. The author has an h-index of 16, co-authored 58 publications.
ORCID: 0000-0003-2318-1257Papers by this author
worksUltracompact On-Chip Branch Line Coupler Based on Through-Silicon Via Technology
2025 · IEEE Transactions on Components Packaging and Manufacturing Technology · 21 citations
https://doi.org/10.1109/tcpmt.2025.3533615
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm
2024 · IEEE Transactions on Components Packaging and Manufacturing Technology · 12 citations
https://doi.org/10.1109/tcpmt.2024.3481036
Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology
2025 · Microelectronics Journal · 1 citations
https://doi.org/10.1016/j.mejo.2025.106618
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