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Bojan Djuric

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Bojan Djuric is an academic researcher. The author has contributed to research in topics: Copper Interconnects and Reliability & 3D IC and TSV technologies & Electronic Packaging and Soldering Technologies.

Research Topics

Copper Interconnects and Reliability 3D IC and TSV technologies Electronic Packaging and Soldering Technologies Electrodeposition and Electroless Coatings Flexible and Reconfigurable Manufacturing Systems

Papers by this author

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Double side interconnection for vertical power components based on macro and nano structured copper interfaces and printed circuit board technologies

2019 · HAL (Le Centre pour la Communication Scientifique Directe) · 0 citations

Bojan Djuric Vincent Bley Julien Morand Olivier Dagut

Research topics

topics

Copper Interconnects and Reliability

3D IC and TSV technologies

Electronic Packaging and Soldering Technologies

Electrodeposition and Electroless Coatings

Flexible and Reconfigurable Manufacturing Systems

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