Revealing the deformation mechanisms of 〈110〉 symmetric tilt grain boundaries in CoCrNi medium-entropy alloy
2023 · International Journal of Plasticity · 128 citations
https://doi.org/10.1016/j.ijplas.2023.103832
D
Dongpeng Hua
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Dongpeng Hua is an academic researcher from City University of Hong Kong. The author has contributed to research in topics: High Entropy Alloys Studies & High-Temperature Coating Behaviors & Metal and Thin Film Mechanics. The author has an h-index of 26, co-authored 36 publications.
ORCID: 0009-0002-5076-4992Papers by this author
worksConcurrently achieving strength-ductility combination and robust anti-wear performance in an in-situ high-entropy bulk metallic glass composite
2024 · Composites Part B Engineering · 84 citations
https://doi.org/10.1016/j.compositesb.2024.111222
Molecular dynamics simulation of deformation mechanism of CoCrNi medium entropy alloy during nanoscratching
2021 · Computational Materials Science · 83 citations
https://doi.org/10.1016/j.commatsci.2021.111085
Altering the Metastable Wear Performance of Metallic Glasses via Mixing Entropy Regulation
2025 · Advanced Functional Materials · 22 citations
https://doi.org/10.1002/adfm.202507634
Unlocking metallic glasses ultra-low friction via high-entropy effect and oxidation
2025 · International Journal of Mechanical Sciences · 18 citations
https://doi.org/10.1016/j.ijmecsci.2025.110507
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