Construction of novel Cu-α-diimide interactions for enhancing thermal resistance and dimensional stability of polyimide films
2023 · Journal of Materials Research and Technology · 13 citations
https://doi.org/10.1016/j.jmrt.2023.06.064
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56
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20
h-index
25
i10-index
Feng Gan is an academic researcher from Sichuan University. The author has contributed to research in topics: Synthesis and properties of polymers & Epoxy Resin Curing Processes & Advanced Sensor and Energy Harvesting Materials. The author has an h-index of 20, co-authored 48 publications.
ORCID: 0000-0003-1486-5833https://doi.org/10.1016/j.jmrt.2023.06.064
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https://doi.org/10.1016/j.csite.2025.107424
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