多
多田 和夫
1
Papers
5
Citations
1
h-index
0
i10-index
多田 和夫 is an academic researcher. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Metallurgy and Material Forming & 3D IC and TSV technologies. The author has an h-index of 1, co-authored 1 publications.
Research Topics
Electronic Packaging and Soldering TechnologiesMetallurgy and Material Forming3D IC and TSV technologies
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