Electronic Packaging and Soldering Technologies
1 works
승
승이 이
Claim or correct this author profile
Claim this profile or suggest corrections to the name, affiliation, bio, photo, or paper titles. Approved changes appear as verified CitedEvidence overlays.
1
Papers
0
Citations
0
h-index
0
i10-index
승이 이 is an academic researcher. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Electrodeposition and Electroless Coatings & Mechanical stress and fatigue analysis.
Research topics
topicsChat about Author
Papers
Chat
Click to start Chat