相
相良 れい子
1
Papers
2
Citations
1
h-index
0
i10-index
相良 れい子 is an academic researcher. The author has contributed to research in topics: Metal and Thin Film Mechanics & Electronic Packaging and Soldering Technologies & Copper Interconnects and Reliability. The author has an h-index of 1, co-authored 1 publications.
Research Topics
Metal and Thin Film MechanicsElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability
Chat about Author
Papers
Chat
Click to start Chat