목
목순 김
Inha University(KR)
3
Papers
9
Citations
2
h-index
0
i10-index
목순 김 is an academic researcher from Inha University. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & 3D IC and TSV technologies & Epoxy Resin Curing Processes. The author has an h-index of 2, co-authored 3 publications.
Research Topics
Electronic Packaging and Soldering Technologies3D IC and TSV technologiesEpoxy Resin Curing ProcessesMaterial Properties and Processing
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