洋
洋 彭
1
Papers
1
Citations
1
h-index
0
i10-index
洋 彭 is an academic researcher. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Adhesion, Friction, and Surface Interactions & Electrical Contact Performance and Analysis. The author has an h-index of 1, co-authored 1 publications.
Research Topics
Electronic Packaging and Soldering TechnologiesAdhesion, Friction, and Surface InteractionsElectrical Contact Performance and Analysis
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