刘

刘春忠

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刘春忠 is an academic researcher. The author has contributed to research in topics: Electronic Packaging and Soldering Technologies & Conducting polymers and applications & 3D IC and TSV technologies.

Research Topics

Electronic Packaging and Soldering Technologies Conducting polymers and applications 3D IC and TSV technologies Copper Interconnects and Reliability

Research topics

topics

Electronic Packaging and Soldering Technologies

2 works

Conducting polymers and applications

1 works

Electromagnetic wave absorption materials

1 works

Advanced Antenna and Metasurface Technologies

1 works

3D IC and TSV technologies

1 works

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